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RF Sensor Technology with FabGuard Sensor Integration and Analysis System
RF Sensor with FabGuard Integration Software Provides Real-time Plasma Process Analysis to Significantly Reduce Process Variability
INFICON RF sensor technology provides highly accurate, multi-variate RF data on actual plasma conditions of both process development and production process problems to significantly reduce process variability. The latest in its suite of advanced process control in situ sensors, this non-intrusive RF sensor combines with the FabGuard Sensor Integration and Analysis System to offer critical diagnostic information, e.g. accurate and repeatable chamber clean and process endpoint, root cause analysis of faults (such as plasma arcing), and process fingerprinting for chamber matching in PVD, CVD, and etch applications.
INFICON RF sensor technology with FabGuard generates highly accurate models that predict wafer metrology results by measuring and performing analysis on fundamental and harmonic voltages and currents, so engineers have the ability to control actual wafer results on every wafer processed. Now FabGuard one-of-a-kind, powerful algorithm capability combines with RF sensor technology to significantly improve repeatability, stability, and accuracy of semiconductor processes, based on real-time measurements and correlation delivered through an easy-to-interpret user interface.
Applications
CVD
- Endpoint / optimization of in situ plasma chamber clean processes
- Active power control of delivered power
- FDC (e.g. arc detection, charging)
- Chamber matching (RF fingerprint)
PVD
- Modeling of wafer parameters such as resistivity
- FDC (e.g. arc detection, charging)
- Chamber matching (RF fingerprint)
Etch
- Endpoint control for etch processes
- Active power control of delivered power
- Modeling of process parameters such as etch rate
- FDC
- Chamber matching (RF fingerprint)
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FabGuard FDC
Manage a process, a tool, or your entire fab
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